It is important for a printed circuit board to perform its function and support the larger electronic device. Consequently, PCB manufacturers must have a system in place that monitors and tests each component to ensure that it meets various standards and delivers maximum performance.

When a component fails, analysts must utilize various processes, tools and techniques. With accuracy, they must determine why the device failed and how to prevent future failures. The following processes present unique challenges for electronics failure analysis:

  • Increased density
  • Higher lead-free process temperature requirements
  • Hazardous material
  • Recycling requirements
  • The need to tune PCBs to precise values
  • Other associated changes in PCB manufacturing